Apple iPhone 6 would feature a faster A8 processor, a revamped camera system, iOS 8, and near field communication (NFC) technology for mobile payments. A new photo leak from Feld & Volk and Sonny Dickson showing an assembled logic board from the 4.7-inch iPhone 6 has revealed a number of pieces of information already, and it appears from one of the photos that the A8 chip on the board does include 1 GB of LPDDR3 RAM. Earlier leaks has also urged that 4.7 inch iPhone will get 1GB of RAM.
A silk-screened part number on the Apple’s A8 chip reveals that the package-on-package contains Hynix RAM. Based on Hynix’s part number format, the character in the eighth position reveals the amount of RAM in the package, with an “8” denoting 8 GB (1 GB) and a “B” denoting 16 GB (2 GB).